A Cylindrical Tuber Encapsulant Geometry for Enhancing Optical Performance of Chip-on-Board Packaging Light-Emitting Diodes
Low light efficiency and poor angular color uniformity (ACU) are the key challenges of chip-on-board packaging light-emitting diodes (LEDs). In this paper, we demonstrate a phosphor geometry, and its controlling method for enhancing the optical performance of chip-on-board packaging LEDs, its fabric...
Saved in:
| Main Authors: | Xingjian Yu, Bin Xie, Bofeng Shang, Qi Chen, Xiaobing Luo |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2016-01-01
|
| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7456194/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
A Fast Method for Lifetime Estimation of Blue Light-Emitting Diode Chips Based on Nonradiative Recombination Defects
by: Lin-Wang Xu, et al.
Published: (2017-01-01) -
Surface distribution of the emitting intensity of GaP light-emitting diodes
by: O. V. Konoreva, et al.
Published: (2013-06-01) -
Highly Stable White Light-Emitting Diodes Based on Quantum-Dots Dispersed Into the Backlight Lens for Display Backlight
by: Xin Yang, et al.
Published: (2019-01-01) -
The Effect of Sapphire Substrates on Omni-Directional Reflector Design for Flip-Chip Near-Ultraviolet Light-Emitting Diodes
by: Yonghui Zhang, et al.
Published: (2019-01-01) -
Optical Tunneling to Improve Light Extraction in Quantum Dot and Perovskite Light-Emitting Diodes
by: Guanding Mei, et al.
Published: (2020-01-01)