Electronics packaging materials and component-level degradation monitoring
Electronic components are complex systems consisting of a combination of different materials, which undergo degenerative changes over time following the second law of thermodynamics. The loss of their quality or functionality is reflected in degraded performance or behaviour of electronic components...
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| Format: | Article |
| Language: | English |
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Frontiers Media S.A.
2025-01-01
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| Series: | Frontiers in Electronics |
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| Online Access: | https://www.frontiersin.org/articles/10.3389/felec.2025.1506112/full |
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| author | Adwait Inamdar Willem D. Van Driel GuoQi Zhang |
| author_facet | Adwait Inamdar Willem D. Van Driel GuoQi Zhang |
| author_sort | Adwait Inamdar |
| collection | DOAJ |
| description | Electronic components are complex systems consisting of a combination of different materials, which undergo degenerative changes over time following the second law of thermodynamics. The loss of their quality or functionality is reflected in degraded performance or behaviour of electronic components, which can lead to failures during their operation lifetime. Thus, it is crucial to understand the physics of material degradation and the factors causing it to ensure component reliability. This paper focuses on the physics-of-degradation of packaging materials, which are typically exposed the most to the environmental and operating loads. The content of this article is organised into three parts. First, an overview of the packaging technology and encapsulating materials is presented. Then, the most common degradation-causing factors and package-associated failure modes are reviewed. Lastly, the hardware requirements are discussed, including specialised sensors, measurement techniques, and Digital Twins, to capture the degradation effects and facilitate component-level health monitoring for microelectronics. |
| format | Article |
| id | doaj-art-d218a129d6d24fcbbf73389c286f56de |
| institution | Kabale University |
| issn | 2673-5857 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Frontiers Media S.A. |
| record_format | Article |
| series | Frontiers in Electronics |
| spelling | doaj-art-d218a129d6d24fcbbf73389c286f56de2025-01-31T06:40:20ZengFrontiers Media S.A.Frontiers in Electronics2673-58572025-01-01610.3389/felec.2025.15061121506112Electronics packaging materials and component-level degradation monitoringAdwait InamdarWillem D. Van DrielGuoQi ZhangElectronic components are complex systems consisting of a combination of different materials, which undergo degenerative changes over time following the second law of thermodynamics. The loss of their quality or functionality is reflected in degraded performance or behaviour of electronic components, which can lead to failures during their operation lifetime. Thus, it is crucial to understand the physics of material degradation and the factors causing it to ensure component reliability. This paper focuses on the physics-of-degradation of packaging materials, which are typically exposed the most to the environmental and operating loads. The content of this article is organised into three parts. First, an overview of the packaging technology and encapsulating materials is presented. Then, the most common degradation-causing factors and package-associated failure modes are reviewed. Lastly, the hardware requirements are discussed, including specialised sensors, measurement techniques, and Digital Twins, to capture the degradation effects and facilitate component-level health monitoring for microelectronics.https://www.frontiersin.org/articles/10.3389/felec.2025.1506112/fullelectronics packagingencapsulation materialmoulding compoundsphysics of degradationthermomechanical ageingfailure mechanisms |
| spellingShingle | Adwait Inamdar Willem D. Van Driel GuoQi Zhang Electronics packaging materials and component-level degradation monitoring Frontiers in Electronics electronics packaging encapsulation material moulding compounds physics of degradation thermomechanical ageing failure mechanisms |
| title | Electronics packaging materials and component-level degradation monitoring |
| title_full | Electronics packaging materials and component-level degradation monitoring |
| title_fullStr | Electronics packaging materials and component-level degradation monitoring |
| title_full_unstemmed | Electronics packaging materials and component-level degradation monitoring |
| title_short | Electronics packaging materials and component-level degradation monitoring |
| title_sort | electronics packaging materials and component level degradation monitoring |
| topic | electronics packaging encapsulation material moulding compounds physics of degradation thermomechanical ageing failure mechanisms |
| url | https://www.frontiersin.org/articles/10.3389/felec.2025.1506112/full |
| work_keys_str_mv | AT adwaitinamdar electronicspackagingmaterialsandcomponentleveldegradationmonitoring AT willemdvandriel electronicspackagingmaterialsandcomponentleveldegradationmonitoring AT guoqizhang electronicspackagingmaterialsandcomponentleveldegradationmonitoring |