Comparison of Berkovich and spherical tip indentation for determining the Young’s modulus of polymer thin films encapsulated by a dielectric
Pixel integrated micro-lenses for CMOS image sensors consist of a stack of polymer acrylate resin films encapsulated by a dielectric layer. Due to the mismatch of thermomechanical properties, adhesive or cohesive fractures can occur. This can lead to reliability issues requiring the knowledge of th...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Czech Technical University in Prague
2024-12-01
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| Series: | Acta Polytechnica CTU Proceedings |
| Subjects: | |
| Online Access: | https://ojs.cvut.cz/ojs/index.php/APP/article/view/10361 |
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