Comparison of Berkovich and spherical tip indentation for determining the Young’s modulus of polymer thin films encapsulated by a dielectric

Pixel integrated micro-lenses for CMOS image sensors consist of a stack of polymer acrylate resin films encapsulated by a dielectric layer. Due to the mismatch of thermomechanical properties, adhesive or cohesive fractures can occur. This can lead to reliability issues requiring the knowledge of th...

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Bibliographic Details
Main Authors: Marina Melo de Lima, Vincent Mandrillon, Jennifer Hay, Laurent-Luc Chapelon, Christophe Poulain, Olivier Lebaigue
Format: Article
Language:English
Published: Czech Technical University in Prague 2024-12-01
Series:Acta Polytechnica CTU Proceedings
Subjects:
Online Access:https://ojs.cvut.cz/ojs/index.php/APP/article/view/10361
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