Solidification behavior of copper/aluminum composites in twin-roll casting under electric fields
Electric field is widely used in the preparation of metallic materials to enhance their properties. In this study, we simulated the solidification behavior of twin-roll casting (TRC) copper/aluminum composites (Cu/Al) using finite volume method. A comparative examination of the temperature distribut...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25000632 |
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| Summary: | Electric field is widely used in the preparation of metallic materials to enhance their properties. In this study, we simulated the solidification behavior of twin-roll casting (TRC) copper/aluminum composites (Cu/Al) using finite volume method. A comparative examination of the temperature distribution, fluid dynamics, and instantaneous cooling rate, is conducted considering scenarios both with and without the influence of an electric field. The introduction of the electric field leads to an elevation in temperature within the molten pool, thereby affecting the solidification process and extending the duration of vortex maintenance. The transient cooling rate is demonstrated to decrease, and the asymmetry in heat transfer within the middle and lower sections is correspondingly reduced. As the electric potential increases, the heat flux can be better transferred laterally, which diminishes the temperature gradient at the Cu/Al interface. In addition, the application of an appropriate electric potential ensures that the sump depth ratio (SDR) is in a reasonable range while enhancing the reaction length ratio (RLR). This enhancement improves the atomic bonding strength at the interface while preserving the continuity of the TRC process. These results are expected to provide a theoretical basis for the development and optimization of the Cu/Al TRC technology. |
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| ISSN: | 2214-157X |