MONITORING OF IC ENCAPSULATION PROCESS
High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Belarusian National Technical University
2015-03-01
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| Series: | Приборы и методы измерений |
| Subjects: | |
| Online Access: | https://pimi.bntu.by/jour/article/view/25 |
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