Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation
In contemporary society, the growing reliance on electronic devices has necessitated the phasing out of traditional Sn–Pb solder due to its health hazards, prompting a transition to environmentally friendly, lead-free alternatives.This study aims to address the challenges of poor interfacial reliabi...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542402893X |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832595355365015552 |
|---|---|
| author | Yuezong Zheng Junchen Liu Hongchao Ji Xiaomin Huang Wenchao Xiao Abdullah Aziz Saad |
| author_facet | Yuezong Zheng Junchen Liu Hongchao Ji Xiaomin Huang Wenchao Xiao Abdullah Aziz Saad |
| author_sort | Yuezong Zheng |
| collection | DOAJ |
| description | In contemporary society, the growing reliance on electronic devices has necessitated the phasing out of traditional Sn–Pb solder due to its health hazards, prompting a transition to environmentally friendly, lead-free alternatives.This study aims to address the challenges of poor interfacial reliability and high cost associated with eutectic Sn–Ag–Cu solders by investigating the creep properties and service life of a low-silver solder alloy, Sn-0.3Ag-0.7Cu, as a filler material.The creep behavior of Sn-0.3Ag-0.7Cu was analyzed through creep testing, and fracture modes were identified via microstructural and fracture surface analysis.The Anand viscoplastic model was employed to simulate and calibrate the creep behavior, with its accuracy validated via thermal cycling experiments.Furthermore, the creep behavior of Ball Grid Array (BGA) solder joints was simulated using Abaqus software to examine the impact of creep on joint longevity and the influence of temperature on performance. |
| format | Article |
| id | doaj-art-c7df7c0d06cb4a2391f1a26655e6cc7d |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-c7df7c0d06cb4a2391f1a26655e6cc7d2025-01-19T06:25:23ZengElsevierJournal of Materials Research and Technology2238-78542025-01-0134585603Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulationYuezong Zheng0Junchen Liu1Hongchao Ji2Xiaomin Huang3Wenchao Xiao4Abdullah Aziz Saad5College of Mechanical Engineering, North China University of Science and Technology, Tangshan, 063210, ChinaSchool of Mechanical Engineering, Universiti Sains Malaysia, 14300, Nibong Tebal, Pulau Pinang, Malaysia; Corresponding author.College of Mechanical Engineering, North China University of Science and Technology, Tangshan, 063210, China; Corresponding author.College of Mechanical Engineering, North China University of Science and Technology, Tangshan, 063210, ChinaShenzhen Institute for Advanced Study, UESTC, Shenzhen, 518000, Guangdong, ChinaSchool of Mechanical Engineering, Universiti Sains Malaysia, 14300, Nibong Tebal, Pulau Pinang, MalaysiaIn contemporary society, the growing reliance on electronic devices has necessitated the phasing out of traditional Sn–Pb solder due to its health hazards, prompting a transition to environmentally friendly, lead-free alternatives.This study aims to address the challenges of poor interfacial reliability and high cost associated with eutectic Sn–Ag–Cu solders by investigating the creep properties and service life of a low-silver solder alloy, Sn-0.3Ag-0.7Cu, as a filler material.The creep behavior of Sn-0.3Ag-0.7Cu was analyzed through creep testing, and fracture modes were identified via microstructural and fracture surface analysis.The Anand viscoplastic model was employed to simulate and calibrate the creep behavior, with its accuracy validated via thermal cycling experiments.Furthermore, the creep behavior of Ball Grid Array (BGA) solder joints was simulated using Abaqus software to examine the impact of creep on joint longevity and the influence of temperature on performance.http://www.sciencedirect.com/science/article/pii/S223878542402893XLead-free solderAnand equationBGA modelTemperature cycle loadCreep |
| spellingShingle | Yuezong Zheng Junchen Liu Hongchao Ji Xiaomin Huang Wenchao Xiao Abdullah Aziz Saad Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation Journal of Materials Research and Technology Lead-free solder Anand equation BGA model Temperature cycle load Creep |
| title | Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation |
| title_full | Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation |
| title_fullStr | Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation |
| title_full_unstemmed | Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation |
| title_short | Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation |
| title_sort | creep of sn 0 3ag 0 7cu solder in electronic packaging experiment and simulation |
| topic | Lead-free solder Anand equation BGA model Temperature cycle load Creep |
| url | http://www.sciencedirect.com/science/article/pii/S223878542402893X |
| work_keys_str_mv | AT yuezongzheng creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation AT junchenliu creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation AT hongchaoji creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation AT xiaominhuang creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation AT wenchaoxiao creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation AT abdullahazizsaad creepofsn03ag07cusolderinelectronicpackagingexperimentandsimulation |