APA (7th ed.) Citation

Zheng, Y., Liu, J., Ji, H., Huang, X., Xiao, W., & Saad, A. A. Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation. Elsevier.

Chicago Style (17th ed.) Citation

Zheng, Yuezong, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, and Abdullah Aziz Saad. Creep of Sn-0.3Ag-0.7Cu Solder in Electronic Packaging: Experiment and Simulation. Elsevier.

MLA (9th ed.) Citation

Zheng, Yuezong, et al. Creep of Sn-0.3Ag-0.7Cu Solder in Electronic Packaging: Experiment and Simulation. Elsevier.