A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration
Inspired by the outstanding performance of natural materials due to their distinctive structures, we utilized direct ink writing (DIW) and pressureless infiltration techniques to design and manufacture innovative SS/Cu composites featuring helical lamellar interpenetrated structures (HLIs). DIW was...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424030722 |
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| author | Likai Yang Bin Yuan Junchi Cen Jinhua He Qiaoli Lin Yu Shi |
| author_facet | Likai Yang Bin Yuan Junchi Cen Jinhua He Qiaoli Lin Yu Shi |
| author_sort | Likai Yang |
| collection | DOAJ |
| description | Inspired by the outstanding performance of natural materials due to their distinctive structures, we utilized direct ink writing (DIW) and pressureless infiltration techniques to design and manufacture innovative SS/Cu composites featuring helical lamellar interpenetrated structures (HLIs). DIW was used to construct SS porous scaffolds with hierarchical pores showcasing HLIs. By taking advantage of the favorable wettability between SS and Cu, we successfully achieved spontaneous Cu infiltration into the SS scaffolds through capillary force, thereby creating SS/Cu composites. Throughout the infiltration process, Cu first occupied smaller pores within the SS filaments before filling up larger channels between them; this resulted in residual pores within Cu matrix. The effects of structural parameters on both scaffolds and composites compressive strength was evaluated. Our findings demonstrate that increasing the helical angle of HLIs gradually enhanced the compressive strength of the SS scaffolds while introducing significant anisotropy. In contrast, due to a high volume fraction (∼60%) of Cu filler, SS/Cu composites exhibited nearly isotropic compressive strength and electrical conductivity. This work presents a demonstration case aiming to develop a scalable 3D printing method for fabricating composites and advancing heterogeneous structural design principles in metallic materials. |
| format | Article |
| id | doaj-art-c6b3570b90284de8aec9829bce7a9bc2 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-c6b3570b90284de8aec9829bce7a9bc22025-01-19T06:26:03ZengElsevierJournal of Materials Research and Technology2238-78542025-01-013429352942A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltrationLikai Yang0Bin Yuan1Junchi Cen2Jinhua He3Qiaoli Lin4Yu Shi5Corresponding author.; State Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaCorresponding author.; State Key Laboratory of Advanced Processing and Recycling of Non-Ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaInspired by the outstanding performance of natural materials due to their distinctive structures, we utilized direct ink writing (DIW) and pressureless infiltration techniques to design and manufacture innovative SS/Cu composites featuring helical lamellar interpenetrated structures (HLIs). DIW was used to construct SS porous scaffolds with hierarchical pores showcasing HLIs. By taking advantage of the favorable wettability between SS and Cu, we successfully achieved spontaneous Cu infiltration into the SS scaffolds through capillary force, thereby creating SS/Cu composites. Throughout the infiltration process, Cu first occupied smaller pores within the SS filaments before filling up larger channels between them; this resulted in residual pores within Cu matrix. The effects of structural parameters on both scaffolds and composites compressive strength was evaluated. Our findings demonstrate that increasing the helical angle of HLIs gradually enhanced the compressive strength of the SS scaffolds while introducing significant anisotropy. In contrast, due to a high volume fraction (∼60%) of Cu filler, SS/Cu composites exhibited nearly isotropic compressive strength and electrical conductivity. This work presents a demonstration case aiming to develop a scalable 3D printing method for fabricating composites and advancing heterogeneous structural design principles in metallic materials.http://www.sciencedirect.com/science/article/pii/S22387854240307223D printingMelt infiltrationHelical-lamellar-interpenetrated structureBioinspired designSS/Cu composite |
| spellingShingle | Likai Yang Bin Yuan Junchi Cen Jinhua He Qiaoli Lin Yu Shi A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration Journal of Materials Research and Technology 3D printing Melt infiltration Helical-lamellar-interpenetrated structure Bioinspired design SS/Cu composite |
| title | A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration |
| title_full | A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration |
| title_fullStr | A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration |
| title_full_unstemmed | A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration |
| title_short | A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration |
| title_sort | novel ss cu composite with bioinspired helical lamellar interpenetrated structure by direct ink writing and pressureless infiltration |
| topic | 3D printing Melt infiltration Helical-lamellar-interpenetrated structure Bioinspired design SS/Cu composite |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424030722 |
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