Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders
This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were conducted at 313 K with a single hole specimen. Stress amplitude of s...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2018-10-01
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| Series: | Fracture and Structural Integrity |
| Subjects: | |
| Online Access: | http://www.gruppofrattura.it/pdf/rivista/numero46/numero_46_art_3.pdf |
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