Hiyoshi, N., Yamashita, M., & Hokazono, H. Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders. Gruppo Italiano Frattura.
Chicago Style (17th ed.) CitationHiyoshi, Noritake, Mitsuo Yamashita, and Hiroaki Hokazono. Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders. Gruppo Italiano Frattura.
MLA (9th ed.) CitationHiyoshi, Noritake, et al. Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders. Gruppo Italiano Frattura.
Warning: These citations may not always be 100% accurate.