In-depth investigation of multi-element alloying on the microstructure and mechanical properties of Sn7Sb/Cu joints
The rapid development of large-scale data exchange and high-power devices necessitates that interconnect joints with enhanced load-bearing capacity and mechanical stability under varying conditions. Traditional SAC and Sn5Sb interconnect materials fall short of meeting these stringent requirements....
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425011664 |
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