Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper

There is increasing interest towards developing carbon nanotube-copper (CNT-Cu) composites due to potentially improved properties. Carbon nanotube macroscopic materials typically exhibit high resistivity, low electrochemical reactivity, and the presence of impurities, which impede its use as a subst...

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Main Authors: Pyry-Mikko Hannula, Minttu Junnila, Dawid Janas, Jari Aromaa, Olof Forsén, Mari Lundström
Format: Article
Language:English
Published: Wiley 2018-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2018/3071913
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author Pyry-Mikko Hannula
Minttu Junnila
Dawid Janas
Jari Aromaa
Olof Forsén
Mari Lundström
author_facet Pyry-Mikko Hannula
Minttu Junnila
Dawid Janas
Jari Aromaa
Olof Forsén
Mari Lundström
author_sort Pyry-Mikko Hannula
collection DOAJ
description There is increasing interest towards developing carbon nanotube-copper (CNT-Cu) composites due to potentially improved properties. Carbon nanotube macroscopic materials typically exhibit high resistivity, low electrochemical reactivity, and the presence of impurities, which impede its use as a substrate for electrochemical deposition of metals. In this research, different CNT fiber pretreatment methods, such as heat treatment, immersion in Watts bath, anodization, and exposure to boric acid (H3BO3), were investigated to improve the electrochemical response for copper deposition. It was shown that these treatments affect the surface activity of CNTs, including electrical resistivity, polarization resistance, and active surface area, which influence the electrodeposition process of copper. Properties of CNT structures and CNT-Cu composites were researched by electrochemical impedance spectroscopy (EIS), galvanostatic copper deposition, scanning electron microscope (SEM), and four-point electrical resistance measurements. Heat treatment, Watts bath, anodization, and boric acid treatments were shown to be effective for modifying the CNT surface reactivity for subsequent electrochemical deposition of copper.
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institution Kabale University
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publishDate 2018-01-01
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series Advances in Materials Science and Engineering
spelling doaj-art-c27ef382b7344c8eba3b7c62b0902d732025-02-03T01:28:40ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422018-01-01201810.1155/2018/30719133071913Carbon Nanotube Fiber Pretreatments for Electrodeposition of CopperPyry-Mikko Hannula0Minttu Junnila1Dawid Janas2Jari Aromaa3Olof Forsén4Mari Lundström5Department of Chemical and Metallurgical Engineering, School of Chemical Engineering, Aalto University, Vuorimiehentie 2, 02150 Espoo, FinlandDepartment of Chemical and Metallurgical Engineering, School of Chemical Engineering, Aalto University, Vuorimiehentie 2, 02150 Espoo, FinlandDepartment of Organic Chemistry, Bioorganic Chemistry and Biotechnology, Silesian University of Technology, B. Krzywoustego 4, 44-100 Gliwice, PolandDepartment of Chemical and Metallurgical Engineering, School of Chemical Engineering, Aalto University, Vuorimiehentie 2, 02150 Espoo, FinlandDepartment of Chemical and Metallurgical Engineering, School of Chemical Engineering, Aalto University, Vuorimiehentie 2, 02150 Espoo, FinlandDepartment of Chemical and Metallurgical Engineering, School of Chemical Engineering, Aalto University, Vuorimiehentie 2, 02150 Espoo, FinlandThere is increasing interest towards developing carbon nanotube-copper (CNT-Cu) composites due to potentially improved properties. Carbon nanotube macroscopic materials typically exhibit high resistivity, low electrochemical reactivity, and the presence of impurities, which impede its use as a substrate for electrochemical deposition of metals. In this research, different CNT fiber pretreatment methods, such as heat treatment, immersion in Watts bath, anodization, and exposure to boric acid (H3BO3), were investigated to improve the electrochemical response for copper deposition. It was shown that these treatments affect the surface activity of CNTs, including electrical resistivity, polarization resistance, and active surface area, which influence the electrodeposition process of copper. Properties of CNT structures and CNT-Cu composites were researched by electrochemical impedance spectroscopy (EIS), galvanostatic copper deposition, scanning electron microscope (SEM), and four-point electrical resistance measurements. Heat treatment, Watts bath, anodization, and boric acid treatments were shown to be effective for modifying the CNT surface reactivity for subsequent electrochemical deposition of copper.http://dx.doi.org/10.1155/2018/3071913
spellingShingle Pyry-Mikko Hannula
Minttu Junnila
Dawid Janas
Jari Aromaa
Olof Forsén
Mari Lundström
Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
Advances in Materials Science and Engineering
title Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
title_full Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
title_fullStr Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
title_full_unstemmed Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
title_short Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper
title_sort carbon nanotube fiber pretreatments for electrodeposition of copper
url http://dx.doi.org/10.1155/2018/3071913
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