Effects of Heteroaromatic Thiol Additives on Co Electrodeposition by Surface Adsorption
Cobalt electrochemical deposition, with its bottom–up growth properties, is a core technology for creating metal interconnects. Additives are crucial during electrodeposition to control the quality of deposits by adsorbing onto the Co surface. The functional groups of additive molecules are the key...
Saved in:
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
|
| Series: | Electrochem |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-3293/6/2/16 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|