Design and numerical simulation of direct cooling evaporators for chip thermal test based on triply periodic minimal surfaces
Aiming at the three-temperature test requirements of high-power density chips, the third generation of refrigerant direct cooling technology has been developed. Three kinds of direct cooling evaporators with triply periodic minimal surfaces (TPMS) are designed and systematically simulated in this pa...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X2500231X |
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