APA (7th ed.) Citation

Guo, F., Fu, J., Zhao, Y., Huang, X., Tong, Z., Bao, J., . . . Sunden, B. Design and numerical simulation of direct cooling evaporators for chip thermal test based on triply periodic minimal surfaces. Elsevier.

Chicago Style (17th ed.) Citation

Guo, Feng, Jiahong Fu, Yi Zhao, Xing Huang, Zhongyao Tong, Junqi Bao, Xiaoge Duan, Yuanxu Feng, and Bengt Sunden. Design and Numerical Simulation of Direct Cooling Evaporators for Chip Thermal Test Based on Triply Periodic Minimal Surfaces. Elsevier.

MLA (9th ed.) Citation

Guo, Feng, et al. Design and Numerical Simulation of Direct Cooling Evaporators for Chip Thermal Test Based on Triply Periodic Minimal Surfaces. Elsevier.