Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%
This paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesa structures in a NaOH 35% solution. Final etching shapes of micromachined structures show a marked anisotropy of type 1. Etching shapes are analysed in terms of the kinematic and tensorial model for the anisotropic...
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Format: | Article |
Language: | English |
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Wiley
2001-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/2001/73462 |
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author | C. R. Tellier C. A. Hodebourg S. Durand |
author_facet | C. R. Tellier C. A. Hodebourg S. Durand |
author_sort | C. R. Tellier |
collection | DOAJ |
description | This paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesa
structures in a NaOH 35% solution. Final etching shapes of micromachined structures
show a marked anisotropy of type 1. Etching shapes are analysed in terms of the
kinematic and tensorial model for the anisotropic dissolution of crystals. Some of
crystallographic planes limiting membranes and mesa are identified from a
stereographic analysis of top contours. Conclusions of this study are in close
agreement with a previous work. |
format | Article |
id | doaj-art-b9396ae56c5148cda031ad578a36a284 |
institution | Kabale University |
issn | 0882-7516 1563-5031 |
language | English |
publishDate | 2001-01-01 |
publisher | Wiley |
record_format | Article |
series | Active and Passive Electronic Components |
spelling | doaj-art-b9396ae56c5148cda031ad578a36a2842025-02-03T06:07:55ZengWileyActive and Passive Electronic Components0882-75161563-50312001-01-0124424326410.1155/2001/73462Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56%C. R. Tellier0C. A. Hodebourg1S. Durand2Laboratoire de Chronométrie Electronique et Piezoélectricité, Ecole Nationale Supérieure de Mécanique et des Microtechniques, 26 Chemin de l'Epitaphe, Besançon cedex 25030, FranceLaboratoire de Chronométrie Electronique et Piezoélectricité, Ecole Nationale Supérieure de Mécanique et des Microtechniques, 26 Chemin de l'Epitaphe, Besançon cedex 25030, FranceLaboratoire d'Acoustique de l'Université du Maine, Avenue Olivier Messiaen, Le Mans cedex 9 72085, FranceThis paper deals with the micromachining of various (h k 0) and (h h l) membrane–mesa structures in a NaOH 35% solution. Final etching shapes of micromachined structures show a marked anisotropy of type 1. Etching shapes are analysed in terms of the kinematic and tensorial model for the anisotropic dissolution of crystals. Some of crystallographic planes limiting membranes and mesa are identified from a stereographic analysis of top contours. Conclusions of this study are in close agreement with a previous work.http://dx.doi.org/10.1155/2001/73462 |
spellingShingle | C. R. Tellier C. A. Hodebourg S. Durand Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% Active and Passive Electronic Components |
title | Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon
Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% |
title_full | Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon
Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% |
title_fullStr | Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon
Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% |
title_full_unstemmed | Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon
Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% |
title_short | Some Investigations on the Anisotropy of the Chemical Etching of (h k 0) and (h h l) Silicon
Plates in a NaOH 35% Solution. Part II: 3D Etching Shapes, Analysis and Comparison with KOH 56% |
title_sort | some investigations on the anisotropy of the chemical etching of h k 0 and h h l silicon plates in a naoh 35 solution part ii 3d etching shapes analysis and comparison with koh 56 |
url | http://dx.doi.org/10.1155/2001/73462 |
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