Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses
In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the thermal stress distribution formulas are obtaine...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2017-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2017/4903924 |
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| _version_ | 1832558127951642624 |
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| author | Yuanying Qiu Xun Qiu Xianghu Guo Dian Wang Lijie Sun |
| author_facet | Yuanying Qiu Xun Qiu Xianghu Guo Dian Wang Lijie Sun |
| author_sort | Yuanying Qiu |
| collection | DOAJ |
| description | In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the thermal stress distribution formulas are obtained. Then, the thermal stress distribution curves of Si/GaAs bonding interfaces are investigated by finite element method (FEM) and are compared with the results from E. Suhir’s bimaterial thermal stress theory. Finally, some effective strategies are proposed to reduce the thermal stresses in the bonding interfaces. |
| format | Article |
| id | doaj-art-b8674af0b26740eaaf4a330687552e08 |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2017-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-b8674af0b26740eaaf4a330687552e082025-02-03T01:33:18ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422017-01-01201710.1155/2017/49039244903924Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding StressesYuanying Qiu0Xun Qiu1Xianghu Guo2Dian Wang3Lijie Sun4Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an 710071, ChinaShanghai Institute of Space Power Sources, Shanghai 200245, ChinaKey Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an 710071, ChinaKey Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an 710071, ChinaShanghai Institute of Space Power Sources, Shanghai 200245, ChinaIn order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the thermal stress distribution formulas are obtained. Then, the thermal stress distribution curves of Si/GaAs bonding interfaces are investigated by finite element method (FEM) and are compared with the results from E. Suhir’s bimaterial thermal stress theory. Finally, some effective strategies are proposed to reduce the thermal stresses in the bonding interfaces.http://dx.doi.org/10.1155/2017/4903924 |
| spellingShingle | Yuanying Qiu Xun Qiu Xianghu Guo Dian Wang Lijie Sun Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses Advances in Materials Science and Engineering |
| title | Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses |
| title_full | Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses |
| title_fullStr | Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses |
| title_full_unstemmed | Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses |
| title_short | Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses |
| title_sort | thermal analysis of si gaas bonding wafers and mitigation strategies of the bonding stresses |
| url | http://dx.doi.org/10.1155/2017/4903924 |
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