APA (7th ed.) Citation

Qiu, Y., Qiu, X., Guo, X., Wang, D., & Sun, L. Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses. Wiley.

Chicago Style (17th ed.) Citation

Qiu, Yuanying, Xun Qiu, Xianghu Guo, Dian Wang, and Lijie Sun. Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses. Wiley.

MLA (9th ed.) Citation

Qiu, Yuanying, et al. Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses. Wiley.

Warning: These citations may not always be 100% accurate.