Reliability analysis based on cascaded-Foster thermal networks for systems-in-package (SiP)
This paper presents a fast and comprehensive method for reliability prediction of 3D System-in-Package (3D SiP) technologies. The proposed approach accounts for both critical wear-out failure mechanisms and mission-specific profiles. A novel reliability assessment framework is introduced to address...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
|
| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025020377 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!