Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition
Highlights With plasma immersion deposition technology, multilayer copper–carbon nanofilms were fabricated and conductivity can achieve up to 30.20% increase compared to pure copper. By applying effective medium theory, first-principles calculations, and density of states analysis, the critical role...
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| Main Authors: | Haotian Weng, Xiwu Zhang, Xuan Liu, Yunhui Tang, Hewei Yuan, Yang Xu, Kun Li, Xiaolu Huang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2025-02-01
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| Series: | Nano-Micro Letters |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40820-024-01628-6 |
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