He, P., Zhang, J., Zhang, J., & Yin, L. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Wiley.
Chicago Style (17th ed.) CitationHe, Piaopiao, Jinlong Zhang, Jianhua Zhang, and Luqiao Yin. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Wiley.
MLA (9th ed.) CitationHe, Piaopiao, et al. Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging. Wiley.
Warning: These citations may not always be 100% accurate.