Kobayashi, T., Shohji, I., & Nakata, Y. Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints. Wiley.
Chicago Style (17th ed.) CitationKobayashi, Tatsuya, Ikuo Shohji, and Yusuke Nakata. Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints. Wiley.
MLA (9th ed.) CitationKobayashi, Tatsuya, et al. Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints. Wiley.
Warning: These citations may not always be 100% accurate.