The Cu–Sn multilevel gradient heterogeneous interface interpenetrative growth mechanism and its regulation strategies
This study investigates the microstructural characteristics of the heterogeneous interface of hot-dip Sn-plated Cu subjected to multistage heat treatment. The findings reveal that, under thermal stress, the phases at the heterogeneous interface exhibit competitive growth. As the diffusion energy of...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425001851 |
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