The Cu–Sn multilevel gradient heterogeneous interface interpenetrative growth mechanism and its regulation strategies

The Cu–Sn multilevel gradient heterogeneous interface interpenetrative growth mechanism and its regulation strategies

This study investigates the microstructural characteristics of the heterogeneous interface of hot-dip Sn-plated Cu subjected to multistage heat treatment. The findings reveal that, under thermal stress, the phases at the heterogeneous interface exhibit competitive growth. As the diffusion energy of...

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Bibliographic Details
Main Authors: Yulu Ouyang, Yahui Liu, Guoshang Zhang, Tao Huang, Weiwei Lu, Dong Liu, Aikui Liu, Kexing Song
Format: Article
Language:English
Published: Elsevier 2025-03-01
Series:Journal of Materials Research and Technology
Subjects:
Cu–Sn
Heterogeneous interface
Interpenetrative growth
Self-stability
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425001851
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Summary:This study investigates the microstructural characteristics of the heterogeneous interface of hot-dip Sn-plated Cu subjected to multistage heat treatment. The findings reveal that, under thermal stress, the phases at the heterogeneous interface exhibit competitive growth. As the diffusion energy of Cu atoms diminishes, the interface undergoes self-stabilization, gradually evolving toward a more stable configuration.
ISSN:2238-7854

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