Zhou, Z., Lang, F., Farlim, V., Zhang, Z., Li, S., & Dong, R. Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials. Frontiers Media S.A.
Chicago Style (17th ed.) CitationZhou, Zhenrui, Fengyong Lang, Vincentius Farlim, Zhongqing Zhang, Shiyang Li, and Ruipeng Dong. Review on Multi-scale Mechanics Fundamentals and Numerical Methods for Electronics Packaging Interconnect Materials. Frontiers Media S.A.
MLA (9th ed.) CitationZhou, Zhenrui, et al. Review on Multi-scale Mechanics Fundamentals and Numerical Methods for Electronics Packaging Interconnect Materials. Frontiers Media S.A.
Warning: These citations may not always be 100% accurate.