Wang, H., Yang, L., Li, H., Zhou, X., & Wang, X. Using Coupled Rheometer-FBRM to Study Rheological Properties and Microstructure of Cemented Paste Backfill. Wiley.
Chicago Style (17th ed.) CitationWang, Hongjiang, Liuhua Yang, Hong Li, Xu Zhou, and Xiaotian Wang. Using Coupled Rheometer-FBRM to Study Rheological Properties and Microstructure of Cemented Paste Backfill. Wiley.
MLA (9th ed.) CitationWang, Hongjiang, et al. Using Coupled Rheometer-FBRM to Study Rheological Properties and Microstructure of Cemented Paste Backfill. Wiley.
Warning: These citations may not always be 100% accurate.