Comparison of magnetron sputtering systems for high-rate deposition of thick copper layers for microelectronic applications
Objectives. When designing production equipment for the implementation of metal film deposition processes, the selection of technological sources for providing the required quality (structure, appearance), maximum process efficiency, and productivity, poses a challenging task. Since laboratory resul...
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| Format: | Article |
| Language: | Russian |
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MIREA - Russian Technological University
2022-10-01
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| Series: | Российский технологический журнал |
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| Online Access: | https://www.rtj-mirea.ru/jour/article/view/565 |
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