Jin, J., Mao, J., Wang, R., & Cui, M. Experimental Study on Ultrasonic Vibration-Assisted Grinding of SiCp/Al Composites Grinding. MDPI AG.
Chicago Style (17th ed.) CitationJin, Jinghao, Jian Mao, Rong Wang, and Mengyang Cui. Experimental Study on Ultrasonic Vibration-Assisted Grinding of SiCp/Al Composites Grinding. MDPI AG.
MLA (9th ed.) CitationJin, Jinghao, et al. Experimental Study on Ultrasonic Vibration-Assisted Grinding of SiCp/Al Composites Grinding. MDPI AG.
Warning: These citations may not always be 100% accurate.