Zimmer, C. Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits. Wiley.
Chicago Style (17th ed.) CitationZimmer, Ch. Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits. Wiley.
MLA (9th ed.) CitationZimmer, Ch. Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits. Wiley.
Warning: These citations may not always be 100% accurate.