The application of organic materials used in IC advanced packaging:A review
With the development of advanced technologies, the importance of semiconductor packaging has been further highlighted. To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which incl...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-04-01
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| Series: | Memories - Materials, Devices, Circuits and Systems |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064625000040 |
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| _version_ | 1832583858471567360 |
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| author | Liu Jikang |
| author_facet | Liu Jikang |
| author_sort | Liu Jikang |
| collection | DOAJ |
| description | With the development of advanced technologies, the importance of semiconductor packaging has been further highlighted. To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which including flip chip (FC), bumping, fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP), 2.5D packaging (interposer), CMOS image sensor through silicon via (CIS-TSV), fan-out panel level packaging (FOPLP) and so on. During the manufacturing process of those IC advanced packaging technologies, many organic materials including photoresist (PR), photosensitive polyimide (PSPI), underfill, epoxy molding compound (EMC), temporary bonding adhesive, high temperature bonding adhesive, dry film and printing ink have been applied. In this paper, we described the application of organic materials including PR, PSPI, underfill, EMC, temporary bonding adhesive, high temperature bonding adhesive, dry film and printing ink used in the IC advanced packaging. |
| format | Article |
| id | doaj-art-9e6c575738b64619a62b9a6895330a60 |
| institution | Kabale University |
| issn | 2773-0646 |
| language | English |
| publishDate | 2025-04-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Memories - Materials, Devices, Circuits and Systems |
| spelling | doaj-art-9e6c575738b64619a62b9a6895330a602025-01-28T04:15:00ZengElsevierMemories - Materials, Devices, Circuits and Systems2773-06462025-04-019100124The application of organic materials used in IC advanced packaging:A reviewLiu Jikang0Department of Physics and Mechanical & Electrical Engineering, Hubei University of Education, Wuhan, 430205, PR ChinaWith the development of advanced technologies, the importance of semiconductor packaging has been further highlighted. To meet the increasing complexity and performance requirements of semiconductor devices, many integrated circuit (IC) advanced packaging technologies have been developed, which including flip chip (FC), bumping, fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP), 2.5D packaging (interposer), CMOS image sensor through silicon via (CIS-TSV), fan-out panel level packaging (FOPLP) and so on. During the manufacturing process of those IC advanced packaging technologies, many organic materials including photoresist (PR), photosensitive polyimide (PSPI), underfill, epoxy molding compound (EMC), temporary bonding adhesive, high temperature bonding adhesive, dry film and printing ink have been applied. In this paper, we described the application of organic materials including PR, PSPI, underfill, EMC, temporary bonding adhesive, high temperature bonding adhesive, dry film and printing ink used in the IC advanced packaging.http://www.sciencedirect.com/science/article/pii/S2773064625000040Advanced technologiesIC advanced packagingOrganic materialsTemporary bonding adhesiveHigh temperature bonding adhesive |
| spellingShingle | Liu Jikang The application of organic materials used in IC advanced packaging:A review Memories - Materials, Devices, Circuits and Systems Advanced technologies IC advanced packaging Organic materials Temporary bonding adhesive High temperature bonding adhesive |
| title | The application of organic materials used in IC advanced packaging:A review |
| title_full | The application of organic materials used in IC advanced packaging:A review |
| title_fullStr | The application of organic materials used in IC advanced packaging:A review |
| title_full_unstemmed | The application of organic materials used in IC advanced packaging:A review |
| title_short | The application of organic materials used in IC advanced packaging:A review |
| title_sort | application of organic materials used in ic advanced packaging a review |
| topic | Advanced technologies IC advanced packaging Organic materials Temporary bonding adhesive High temperature bonding adhesive |
| url | http://www.sciencedirect.com/science/article/pii/S2773064625000040 |
| work_keys_str_mv | AT liujikang theapplicationoforganicmaterialsusedinicadvancedpackagingareview AT liujikang applicationoforganicmaterialsusedinicadvancedpackagingareview |