Impact of voids on the solder joint integrity and fatigue life of IGBT power module
Insulated gate bipolar transistor (IGBT) power module is a key component of actuator devices in many systems which include electric vehicles (EVs). However, as the deployment of IGBT modules penetrates several mission-critical systems operating in harsher ambient, process voids in the solder joints...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Power Electronic Devices and Components |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772370425000239 |
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