Enhancing thermal performance in power electronic modules through a novel micro-nozzle model and hybrid nanoparticles with varied shape factors
Temperature uniformity in high-heat-flux electronic devices is an important concern in the field of micro-scale heat transfer. The present study recommends four novel configurations of cone-shaped nozzles to reduce the temperature of Si-IGBT electrical modules. Moreover, the thermal characteristics...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | International Journal of Thermofluids |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202724003835 |
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