Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles
The coalescence and melting process of different sizes and arrangements of Ag and Cu nanoparticles is studied through the molecular dynamics (MD) method. The results show that the twin boundary or stacking fault formation and atomic diffusion of the nanoparticles play an important role in the differ...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2021-01-01
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| Series: | Advances in Condensed Matter Physics |
| Online Access: | http://dx.doi.org/10.1155/2021/9945723 |
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| author | Hui Guo LinFu Zhang Qiang Zhu ChuanJie Wang Gang Chen Peng Zhang |
| author_facet | Hui Guo LinFu Zhang Qiang Zhu ChuanJie Wang Gang Chen Peng Zhang |
| author_sort | Hui Guo |
| collection | DOAJ |
| description | The coalescence and melting process of different sizes and arrangements of Ag and Cu nanoparticles is studied through the molecular dynamics (MD) method. The results show that the twin boundary or stacking fault formation and atomic diffusion of the nanoparticles play an important role in the different stages of the heating process. At the beginning of the simulation, Cu and Ag nanoparticles will contact to each other in a very short time. As the temperature goes up, Cu and Ag nanoparticles may generate stacking fault or twin boundary to stabilize the interface structure. When the temperature reaches a critical value, the atoms gain a strong ability to diffuse and eventually melt into one liquid sphere. The coalescence point and melting temperature increase as cluster diameter increases. Moreover, the arrangement of Cu and Ag nanoparticles has a certain effect on the stability of the initial joint interface, which will affect subsequent coalescence and melting behavior. |
| format | Article |
| id | doaj-art-9c04b0c4d5ba4b8495e741647217cea4 |
| institution | Kabale University |
| issn | 1687-8108 1687-8124 |
| language | English |
| publishDate | 2021-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Condensed Matter Physics |
| spelling | doaj-art-9c04b0c4d5ba4b8495e741647217cea42025-02-03T01:00:15ZengWileyAdvances in Condensed Matter Physics1687-81081687-81242021-01-01202110.1155/2021/99457239945723Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag NanoparticlesHui Guo0LinFu Zhang1Qiang Zhu2ChuanJie Wang3Gang Chen4Peng Zhang5School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaSchool of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaSchool of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaSchool of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaSchool of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaSchool of Materials Science and Engineering, Harbin Institute of Technology at Weihai, 2 Wenhuaxi Road, Weihai 264209, ChinaThe coalescence and melting process of different sizes and arrangements of Ag and Cu nanoparticles is studied through the molecular dynamics (MD) method. The results show that the twin boundary or stacking fault formation and atomic diffusion of the nanoparticles play an important role in the different stages of the heating process. At the beginning of the simulation, Cu and Ag nanoparticles will contact to each other in a very short time. As the temperature goes up, Cu and Ag nanoparticles may generate stacking fault or twin boundary to stabilize the interface structure. When the temperature reaches a critical value, the atoms gain a strong ability to diffuse and eventually melt into one liquid sphere. The coalescence point and melting temperature increase as cluster diameter increases. Moreover, the arrangement of Cu and Ag nanoparticles has a certain effect on the stability of the initial joint interface, which will affect subsequent coalescence and melting behavior.http://dx.doi.org/10.1155/2021/9945723 |
| spellingShingle | Hui Guo LinFu Zhang Qiang Zhu ChuanJie Wang Gang Chen Peng Zhang Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles Advances in Condensed Matter Physics |
| title | Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles |
| title_full | Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles |
| title_fullStr | Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles |
| title_full_unstemmed | Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles |
| title_short | Molecular Dynamics Simulation of the Coalescence and Melting Process of Cu and Ag Nanoparticles |
| title_sort | molecular dynamics simulation of the coalescence and melting process of cu and ag nanoparticles |
| url | http://dx.doi.org/10.1155/2021/9945723 |
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