APA (7th ed.) Citation

Tang, F., He, S., Li, Y., Liu, w., Dong, F., & Liu, S. Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions. Nature Publishing Group.

Chicago Style (17th ed.) Citation

Tang, Feixiang, Siyu He, Yuhan Li, wenjin Liu, Fang Dong, and Sheng Liu. Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions. Nature Publishing Group.

MLA (9th ed.) Citation

Tang, Feixiang, et al. Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions. Nature Publishing Group.