Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation
In this study, the nano-scale creep behavior of biaxially oriented polyamide 6 (BOPA6) films was investigated via instrumented nanoindentation. A modified empirical equation was proposed to characterize the evolution of strain rate during the loading stage, showing excellent agreement with the exper...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-09-01
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| Series: | Polymer Testing |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941825002375 |
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| author | Zhenyan Xie Guangkai Liao Yuejun Liu Yuankang Li Bowen Li Lingna Cui Shuhong Fan Diansong Gan |
| author_facet | Zhenyan Xie Guangkai Liao Yuejun Liu Yuankang Li Bowen Li Lingna Cui Shuhong Fan Diansong Gan |
| author_sort | Zhenyan Xie |
| collection | DOAJ |
| description | In this study, the nano-scale creep behavior of biaxially oriented polyamide 6 (BOPA6) films was investigated via instrumented nanoindentation. A modified empirical equation was proposed to characterize the evolution of strain rate during the loading stage, showing excellent agreement with the experimental data (R2 > 0.99). It was observed that an elevated loading rate resulted in higher strain rates and smoother strain-displacement curves, indicating a transition from thermally activated localized deformation to stress-driven cooperative mechanisms, as described by the Eyring activation model. In the holding stage, a power-law equation was used to analyze the creep behavior and determine the creep stress exponent n. It can be found that the value of n increased significantly with the elevated maximum holding load, suggesting enhanced stress sensitivity and the activation of viscoplastic mechanisms. These time-dependent deformation mechanisms were further interpreted within the framework of the Eyring activation model, which clarified the transition from local thermally activated molecular rearrangement to stress-driven cooperative deformation. Overall, these results deepen the understanding of nano-scale creep behavior in semi-crystalline polymers and offer theoretical guidance for enhancing the mechanical properties of BOPA6 films in advanced packaging and flexible electronics. |
| format | Article |
| id | doaj-art-8ea2dd3f1ea64f2eb3559197d7f2bfc2 |
| institution | Kabale University |
| issn | 1873-2348 |
| language | English |
| publishDate | 2025-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Polymer Testing |
| spelling | doaj-art-8ea2dd3f1ea64f2eb3559197d7f2bfc22025-08-20T04:02:23ZengElsevierPolymer Testing1873-23482025-09-0115010892310.1016/j.polymertesting.2025.108923Investigating the nano-scale creep behavior of BOPA6 films via nanoindentationZhenyan Xie0Guangkai Liao1Yuejun Liu2Yuankang Li3Bowen Li4Lingna Cui5Shuhong Fan6Diansong Gan7School of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China; School of Materials Science and Engineering, Hunan University of Technology, Zhuzhou, ChinaSchool of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China; Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou, 412007, China; Corresponding author. School of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China.School of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China; Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou, 412007, China; Corresponding author. School of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China.School of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, ChinaSchool of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, ChinaSchool of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China; Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou, 412007, ChinaSchool of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, China; Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou, 412007, ChinaSchool of Packaging Engineering, Hunan University of Technology, Zhuzhou, 412007, ChinaIn this study, the nano-scale creep behavior of biaxially oriented polyamide 6 (BOPA6) films was investigated via instrumented nanoindentation. A modified empirical equation was proposed to characterize the evolution of strain rate during the loading stage, showing excellent agreement with the experimental data (R2 > 0.99). It was observed that an elevated loading rate resulted in higher strain rates and smoother strain-displacement curves, indicating a transition from thermally activated localized deformation to stress-driven cooperative mechanisms, as described by the Eyring activation model. In the holding stage, a power-law equation was used to analyze the creep behavior and determine the creep stress exponent n. It can be found that the value of n increased significantly with the elevated maximum holding load, suggesting enhanced stress sensitivity and the activation of viscoplastic mechanisms. These time-dependent deformation mechanisms were further interpreted within the framework of the Eyring activation model, which clarified the transition from local thermally activated molecular rearrangement to stress-driven cooperative deformation. Overall, these results deepen the understanding of nano-scale creep behavior in semi-crystalline polymers and offer theoretical guidance for enhancing the mechanical properties of BOPA6 films in advanced packaging and flexible electronics.http://www.sciencedirect.com/science/article/pii/S0142941825002375BOPA6Nanoindentation creepEmpirical equationStress exponentEyring activation model |
| spellingShingle | Zhenyan Xie Guangkai Liao Yuejun Liu Yuankang Li Bowen Li Lingna Cui Shuhong Fan Diansong Gan Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation Polymer Testing BOPA6 Nanoindentation creep Empirical equation Stress exponent Eyring activation model |
| title | Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation |
| title_full | Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation |
| title_fullStr | Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation |
| title_full_unstemmed | Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation |
| title_short | Investigating the nano-scale creep behavior of BOPA6 films via nanoindentation |
| title_sort | investigating the nano scale creep behavior of bopa6 films via nanoindentation |
| topic | BOPA6 Nanoindentation creep Empirical equation Stress exponent Eyring activation model |
| url | http://www.sciencedirect.com/science/article/pii/S0142941825002375 |
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