A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography
This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D image...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2024-06-01
|
| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | https://journals.pan.pl/Content/131907/AMM-2024-2-43-Tan.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 μm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper. |
|---|---|
| ISSN: | 2300-1909 |