Feng-lian, S., Wen-peng, L., & Zhen, P. The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints. Harbin University of Science and Technology Publications.
Chicago Style (17th ed.) CitationFeng-lian, SUN, LI Wen-peng, and PAN Zhen. The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints. Harbin University of Science and Technology Publications.
MLA (9th ed.) CitationFeng-lian, SUN, et al. The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints. Harbin University of Science and Technology Publications.
Warning: These citations may not always be 100% accurate.