Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy

Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy

To clarify the evolution of the interfacial microstructure of GH4065A superalloy during plastic deformation bonding， the GH4065A superalloy is bonded under temperatures of 1050-1110 ℃ with the pressure of 20-40 MPa and a time range of 20-35 min. OM，SEM， and EBSD were employed to characterize the sp...

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Bibliographic Details
Main Authors: SU Lidong, MENG Qingqi, NING Yongquan, HUANG Shuo, ZHANG Wenyun, ZHANG Beijiang
Format: Article
Language:zho
Published: Journal of Materials Engineering 2025-01-01
Series:Cailiao gongcheng
Subjects:
gh4065a superalloy
plastic deformation bonding
interfacial microstructure
dynamic recrystallization
interfacial healing
Online Access:https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846
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https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846

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