Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy
To clarify the evolution of the interfacial microstructure of GH4065A superalloy during plastic deformation bonding， the GH4065A superalloy is bonded under temperatures of 1050-1110 ℃ with the pressure of 20-40 MPa and a time range of 20-35 min. OM，SEM， and EBSD were employed to characterize the sp...
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Journal of Materials Engineering
2025-01-01
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| Series: | Cailiao gongcheng |
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| Online Access: | https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846 |
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| author | SU Lidong MENG Qingqi NING Yongquan HUANG Shuo ZHANG Wenyun ZHANG Beijiang |
| author_facet | SU Lidong MENG Qingqi NING Yongquan HUANG Shuo ZHANG Wenyun ZHANG Beijiang |
| author_sort | SU Lidong |
| collection | DOAJ |
| description | To clarify the evolution of the interfacial microstructure of GH4065A superalloy during plastic deformation bonding， the GH4065A superalloy is bonded under temperatures of 1050-1110 ℃ with the pressure of 20-40 MPa and a time range of 20-35 min. OM，SEM， and EBSD were employed to characterize the special positions between bonding regions and unbinding regions to investigate further the influence of plastic deformation bonding parameters（bonding temperature，holding time，and bonding pressure） on the microstructural evolution of the interface.This study focuses on the nucleation of new recrystallization grains in the bonding area and the healing of the original interface. The results show that increasing the bonding temperature， pressure and the holding time will facilitate the healing of the interface. but at the same time， it will also prompte the coarsening of the grains simultaneously. The joint obtained under 1080 ℃，30 MPa，30 min has uniform microstructure and no obvious defects， exhibiting an excellent metallurgical bonding effect.The results of EBSD show that the discontinuous dynamic recrystallization characterized by strain-induced grain boundary bulging is the dominant mechanism， and continuous dynamic recrystallization characterized by subgrain progressive rotation occurs in the bonding process. Moreover， the dynamic recrystallization（DRX）nuclei will grow toward the interface with ongoing deformation， contributing to the healing of the original interface.The metallurgical bonding caused by plastic deformation bonding mainly experiences three stages： initial contact， nucleation and grain growth， and joint formation. |
| format | Article |
| id | doaj-art-8d2b5c1b487e4163823212976e299854 |
| institution | Kabale University |
| issn | 1001-4381 |
| language | zho |
| publishDate | 2025-01-01 |
| publisher | Journal of Materials Engineering |
| record_format | Article |
| series | Cailiao gongcheng |
| spelling | doaj-art-8d2b5c1b487e4163823212976e2998542025-01-21T09:44:41ZzhoJournal of Materials EngineeringCailiao gongcheng1001-43812025-01-015319910910.11868/j.issn.1001-4381.2023.0008461001-4381（2025）01-0099-11Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloySU Lidong0MENG Qingqi1NING Yongquan2HUANG Shuo3ZHANG Wenyun4ZHANG Beijiang5School of Materials Science and Engineering，Northwestern Polytechnical University，Xi’an 710072，ChinaSchool of Materials Science and Engineering，Northwestern Polytechnical University，Xi’an 710072，ChinaSchool of Materials Science and Engineering，Northwestern Polytechnical University，Xi’an 710072，ChinaHigh Temperature Materials Research Division，Central Iron;& Steel Research Institute，Beijing 100081，ChinaHigh Temperature Materials Research Division，Central Iron;& Steel Research Institute，Beijing 100081，ChinaHigh Temperature Materials Research Division，Central Iron;& Steel Research Institute，Beijing 100081，ChinaTo clarify the evolution of the interfacial microstructure of GH4065A superalloy during plastic deformation bonding， the GH4065A superalloy is bonded under temperatures of 1050-1110 ℃ with the pressure of 20-40 MPa and a time range of 20-35 min. OM，SEM， and EBSD were employed to characterize the special positions between bonding regions and unbinding regions to investigate further the influence of plastic deformation bonding parameters（bonding temperature，holding time，and bonding pressure） on the microstructural evolution of the interface.This study focuses on the nucleation of new recrystallization grains in the bonding area and the healing of the original interface. The results show that increasing the bonding temperature， pressure and the holding time will facilitate the healing of the interface. but at the same time， it will also prompte the coarsening of the grains simultaneously. The joint obtained under 1080 ℃，30 MPa，30 min has uniform microstructure and no obvious defects， exhibiting an excellent metallurgical bonding effect.The results of EBSD show that the discontinuous dynamic recrystallization characterized by strain-induced grain boundary bulging is the dominant mechanism， and continuous dynamic recrystallization characterized by subgrain progressive rotation occurs in the bonding process. Moreover， the dynamic recrystallization（DRX）nuclei will grow toward the interface with ongoing deformation， contributing to the healing of the original interface.The metallurgical bonding caused by plastic deformation bonding mainly experiences three stages： initial contact， nucleation and grain growth， and joint formation.https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846gh4065a superalloyplastic deformation bondinginterfacial microstructuredynamic recrystallizationinterfacial healing |
| spellingShingle | SU Lidong MENG Qingqi NING Yongquan HUANG Shuo ZHANG Wenyun ZHANG Beijiang Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy Cailiao gongcheng gh4065a superalloy plastic deformation bonding interfacial microstructure dynamic recrystallization interfacial healing |
| title | Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy |
| title_full | Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy |
| title_fullStr | Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy |
| title_full_unstemmed | Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy |
| title_short | Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy |
| title_sort | interfacial microstructure evolution behavior during plastic deformation bonding of gh4065a superalloy |
| topic | gh4065a superalloy plastic deformation bonding interfacial microstructure dynamic recrystallization interfacial healing |
| url | https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846 |
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