Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X...
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Format: | Article |
Language: | English |
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Wiley
1985-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/1985/21431 |
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author | Maria Prudenziati Bruno Morten Maria Franca Brigatti |
author_facet | Maria Prudenziati Bruno Morten Maria Franca Brigatti |
author_sort | Maria Prudenziati |
collection | DOAJ |
description | Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The
evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a
peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray
diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of
thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear
picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly
with the performance of the films in terms of resistivity and adhesion. |
format | Article |
id | doaj-art-87d19b8190564b53b84d289712b83529 |
institution | Kabale University |
issn | 0882-7516 1563-5031 |
language | English |
publishDate | 1985-01-01 |
publisher | Wiley |
record_format | Article |
series | Active and Passive Electronic Components |
spelling | doaj-art-87d19b8190564b53b84d289712b835292025-02-03T06:06:11ZengWileyActive and Passive Electronic Components0882-75161563-50311985-01-01121415710.1155/1985/21431Evolution of the Microstructure and Performance of Pd/Ag - Based Thick ConductorsMaria Prudenziati0Bruno Morten1Maria Franca Brigatti2Dipartimento di Fisica dell'Università di Modena, ItalyDipartimento di Fisica dell'Università di Modena, ItalyIstituto di Mineralogia e Petrologia dell'Università di Modena, ItalyPd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of resistivity and adhesion.http://dx.doi.org/10.1155/1985/21431 |
spellingShingle | Maria Prudenziati Bruno Morten Maria Franca Brigatti Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors Active and Passive Electronic Components |
title | Evolution of the Microstructure and Performance of Pd/Ag - Based
Thick Conductors |
title_full | Evolution of the Microstructure and Performance of Pd/Ag - Based
Thick Conductors |
title_fullStr | Evolution of the Microstructure and Performance of Pd/Ag - Based
Thick Conductors |
title_full_unstemmed | Evolution of the Microstructure and Performance of Pd/Ag - Based
Thick Conductors |
title_short | Evolution of the Microstructure and Performance of Pd/Ag - Based
Thick Conductors |
title_sort | evolution of the microstructure and performance of pd ag based thick conductors |
url | http://dx.doi.org/10.1155/1985/21431 |
work_keys_str_mv | AT mariaprudenziati evolutionofthemicrostructureandperformanceofpdagbasedthickconductors AT brunomorten evolutionofthemicrostructureandperformanceofpdagbasedthickconductors AT mariafrancabrigatti evolutionofthemicrostructureandperformanceofpdagbasedthickconductors |