Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors

Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X...

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Main Authors: Maria Prudenziati, Bruno Morten, Maria Franca Brigatti
Format: Article
Language:English
Published: Wiley 1985-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/1985/21431
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author Maria Prudenziati
Bruno Morten
Maria Franca Brigatti
author_facet Maria Prudenziati
Bruno Morten
Maria Franca Brigatti
author_sort Maria Prudenziati
collection DOAJ
description Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of resistivity and adhesion.
format Article
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institution Kabale University
issn 0882-7516
1563-5031
language English
publishDate 1985-01-01
publisher Wiley
record_format Article
series Active and Passive Electronic Components
spelling doaj-art-87d19b8190564b53b84d289712b835292025-02-03T06:06:11ZengWileyActive and Passive Electronic Components0882-75161563-50311985-01-01121415710.1155/1985/21431Evolution of the Microstructure and Performance of Pd/Ag - Based Thick ConductorsMaria Prudenziati0Bruno Morten1Maria Franca Brigatti2Dipartimento di Fisica dell'Università di Modena, ItalyDipartimento di Fisica dell'Università di Modena, ItalyIstituto di Mineralogia e Petrologia dell'Università di Modena, ItalyPd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of resistivity and adhesion.http://dx.doi.org/10.1155/1985/21431
spellingShingle Maria Prudenziati
Bruno Morten
Maria Franca Brigatti
Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
Active and Passive Electronic Components
title Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
title_full Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
title_fullStr Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
title_full_unstemmed Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
title_short Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors
title_sort evolution of the microstructure and performance of pd ag based thick conductors
url http://dx.doi.org/10.1155/1985/21431
work_keys_str_mv AT mariaprudenziati evolutionofthemicrostructureandperformanceofpdagbasedthickconductors
AT brunomorten evolutionofthemicrostructureandperformanceofpdagbasedthickconductors
AT mariafrancabrigatti evolutionofthemicrostructureandperformanceofpdagbasedthickconductors