The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system
The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were carried out using the sessile drop method, dilatometric technique and capillary method. The measurements were performed at temperature range...
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| Format: | Article |
| Language: | English |
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University of Belgrade, Technical Faculty, Bor
2017-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
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| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2017/1450-53391700037P.pdf |
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| author | Pstruś J. |
| author_facet | Pstruś J. |
| author_sort | Pstruś J. |
| collection | DOAJ |
| description | The measurements of surface tension, density and viscosity of liquid Sn-Zn
eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were
carried out using the sessile drop method, dilatometric technique and
capillary method. The measurements were performed at temperature range
between 493 and 843 K. The technique of sessile drop was applied in the
measurements of wetting angles and spreading test in the SnZnIn/ Cu system.
Surface tension, density and viscosity measurements were carried out in a
protective argon-hydrogen atmosphere. Wettability tests were performed in air
in the presence of flux Alu33, at 250°C for 2 minutes. Subsequently, the
microstructure of solder and the resulting joints was studied. The addition
of In to eutectic Sn-Zn alloy improved the wetting properties and causes a
reduction of thickness of the intermetallic compounds layer created at the
interface between the liquid solder and the Cu substrate. |
| format | Article |
| id | doaj-art-83d68280a4944a0189050b85a817158a |
| institution | Kabale University |
| issn | 1450-5339 2217-7175 |
| language | English |
| publishDate | 2017-01-01 |
| publisher | University of Belgrade, Technical Faculty, Bor |
| record_format | Article |
| series | Journal of Mining and Metallurgy. Section B: Metallurgy |
| spelling | doaj-art-83d68280a4944a0189050b85a817158a2025-02-02T23:20:16ZengUniversity of Belgrade, Technical Faculty, BorJournal of Mining and Metallurgy. Section B: Metallurgy1450-53392217-71752017-01-0153330931810.2298/JMMB170728037P1450-53391700037PThe role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn systemPstruś J.0Polish Academy of Sciences, Institute of Metallurgy and Materials Science, Krakow, PolandThe measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were carried out using the sessile drop method, dilatometric technique and capillary method. The measurements were performed at temperature range between 493 and 843 K. The technique of sessile drop was applied in the measurements of wetting angles and spreading test in the SnZnIn/ Cu system. Surface tension, density and viscosity measurements were carried out in a protective argon-hydrogen atmosphere. Wettability tests were performed in air in the presence of flux Alu33, at 250°C for 2 minutes. Subsequently, the microstructure of solder and the resulting joints was studied. The addition of In to eutectic Sn-Zn alloy improved the wetting properties and causes a reduction of thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate.http://www.doiserbia.nb.rs/img/doi/1450-5339/2017/1450-53391700037P.pdflead-free soldersSn-Zn-In liquid alloysintermetaic Cu-Znwettabilityviscositysurface tensiondensity |
| spellingShingle | Pstruś J. The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system Journal of Mining and Metallurgy. Section B: Metallurgy lead-free solders Sn-Zn-In liquid alloys intermetaic Cu-Zn wettability viscosity surface tension density |
| title | The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system |
| title_full | The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system |
| title_fullStr | The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system |
| title_full_unstemmed | The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system |
| title_short | The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system |
| title_sort | role of physico chemical properties of liquid solder in reactive wetting the cu snznin system |
| topic | lead-free solders Sn-Zn-In liquid alloys intermetaic Cu-Zn wettability viscosity surface tension density |
| url | http://www.doiserbia.nb.rs/img/doi/1450-5339/2017/1450-53391700037P.pdf |
| work_keys_str_mv | AT pstrusj theroleofphysicochemicalpropertiesofliquidsolderinreactivewettingthecusnzninsystem AT pstrusj roleofphysicochemicalpropertiesofliquidsolderinreactivewettingthecusnzninsystem |