The Impact of Baseplate Bow on Vacuum Reflow Soldering
The impact of IGBT baseplate bow on reflow soldering is analyzed. And the process parameters are adjusted to eliminate the influence of baseplate bow on soldering quality.
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2011-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.03.002 |
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