Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding
Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville d...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2021-05-01
|
| Series: | International Journal of Distributed Sensor Networks |
| Online Access: | https://doi.org/10.1177/15501477211018346 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832547295884738560 |
|---|---|
| author | Wuwei Feng Xin Chen Cuizhu Wang Yuzhou Shi |
| author_facet | Wuwei Feng Xin Chen Cuizhu Wang Yuzhou Shi |
| author_sort | Wuwei Feng |
| collection | DOAJ |
| description | Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville distribution and empirical mode decomposition methods, the features of bonding electrical signals were extracted. Then, the principal component analysis method was further used for feature selection. Finally, an artificial neural network was built to recognize and detect the quality of ultrasonic wire bonding. The results showed that the average recognition accuracy of Wigner–Ville distribution and empirical mode decomposition was 78% and 93%, respectively. The recognition accuracy of empirical mode decomposition is obviously higher than that of the Wigner–Ville distribution method. In general, using the time–frequency analysis method to classify and identify the fault bonds improved the quality of the wire-bonding products. |
| format | Article |
| id | doaj-art-802af41e68974cffa5d835dddd3fdd54 |
| institution | Kabale University |
| issn | 1550-1477 |
| language | English |
| publishDate | 2021-05-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Distributed Sensor Networks |
| spelling | doaj-art-802af41e68974cffa5d835dddd3fdd542025-02-03T06:45:17ZengWileyInternational Journal of Distributed Sensor Networks1550-14772021-05-011710.1177/15501477211018346Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bondingWuwei Feng0Xin Chen1Cuizhu Wang2Yuzhou Shi3Dong hai Institute of Science and Technology, Zhejiang Ocean University, Zhoushan, ChinaSchool of Marine Engineer Equipment, Zhejiang Ocean University, Zhoushan, ChinaSchool of Marine Engineer Equipment, Zhejiang Ocean University, Zhoushan, ChinaSchool of Marine Engineer Equipment, Zhejiang Ocean University, Zhoushan, ChinaImperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville distribution and empirical mode decomposition methods, the features of bonding electrical signals were extracted. Then, the principal component analysis method was further used for feature selection. Finally, an artificial neural network was built to recognize and detect the quality of ultrasonic wire bonding. The results showed that the average recognition accuracy of Wigner–Ville distribution and empirical mode decomposition was 78% and 93%, respectively. The recognition accuracy of empirical mode decomposition is obviously higher than that of the Wigner–Ville distribution method. In general, using the time–frequency analysis method to classify and identify the fault bonds improved the quality of the wire-bonding products.https://doi.org/10.1177/15501477211018346 |
| spellingShingle | Wuwei Feng Xin Chen Cuizhu Wang Yuzhou Shi Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding International Journal of Distributed Sensor Networks |
| title | Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding |
| title_full | Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding |
| title_fullStr | Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding |
| title_full_unstemmed | Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding |
| title_short | Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding |
| title_sort | application research on the time frequency analysis method in the quality detection of ultrasonic wire bonding |
| url | https://doi.org/10.1177/15501477211018346 |
| work_keys_str_mv | AT wuweifeng applicationresearchonthetimefrequencyanalysismethodinthequalitydetectionofultrasonicwirebonding AT xinchen applicationresearchonthetimefrequencyanalysismethodinthequalitydetectionofultrasonicwirebonding AT cuizhuwang applicationresearchonthetimefrequencyanalysismethodinthequalitydetectionofultrasonicwirebonding AT yuzhoushi applicationresearchonthetimefrequencyanalysismethodinthequalitydetectionofultrasonicwirebonding |