Feng, W., Chen, X., Wang, C., & Shi, Y. Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding. Wiley.
Chicago Style (17th ed.) CitationFeng, Wuwei, Xin Chen, Cuizhu Wang, and Yuzhou Shi. Application Research on the Time–frequency Analysis Method in the Quality Detection of Ultrasonic Wire Bonding. Wiley.
MLA (9th ed.) CitationFeng, Wuwei, et al. Application Research on the Time–frequency Analysis Method in the Quality Detection of Ultrasonic Wire Bonding. Wiley.
Warning: These citations may not always be 100% accurate.