Recovery of Silicon Kerf Through Oxidative Cleaning and Drying Process

Recovery of Silicon Kerf Through Oxidative Cleaning and Drying Process

High quantity of slurries, kerf, are generated during ingot wafering and represent up to 40% of the silicon in weight. The highly pure silicon contained in kerf is contaminated with organics, metal impurities, water and an oxide layer. The recovery of the silicon could be an efficient way to reduce...

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Bibliographic Details
Main Authors: Marion Chevallier, Jean-Baptiste Antoine, Francis Marchitto, Yoann Doré, Yun Luo, Yohan Parsa
Format: Article
Language:English
Published: TIB Open Publishing 2025-02-01
Series:SiliconPV Conference Proceedings
Subjects:
Kerf
Silicon
Recycling
Oxidative Process
Cleaning Process
Online Access:https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1301
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