Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects

Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects

A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 <inline-formula> <tex-math notation="LaTeX">$\times$</tex-math></inline-formula> 0.65 mm<sup>2</sup> for off-chip and on-chip interconnects is demonstrated...

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Bibliographic Details
Main Authors: Kaixuan Chen, Qiangsheng Huang, Jianhao Zhang, Jianxin Cheng, Xin Fu, Chenzhao Zhang, Keqi Ma, Yaocheng Shi, Dries Van Thourhout, Gunther Roelkens, Liu Liu, Sailing He
Format: Article
Language:English
Published: IEEE 2016-01-01
Series:IEEE Photonics Journal
Subjects:
Optical interconnects
Waveguide devices
Electro‐optical systems
Online Access:https://ieeexplore.ieee.org/document/7378272/
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Summary:A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 <inline-formula> <tex-math notation="LaTeX">$\times$</tex-math></inline-formula> 0.65 mm<sup>2</sup> for off-chip and on-chip interconnects is demonstrated on a single silicon-on-insulator chip. An arrayed waveguide grating is used as the (de)multiplexer, and III-V electroabsorption sections fabricated by hybrid integration technology are used as both modulators and detectors, which also enable duplex links. The 30-Gb/s capacity for each of the six wavelength channels for the off-chip transceiver is demonstrated. For the on-chip interconnect, an electrical-to-electrical 3-dB bandwidth of 13 GHz and a data rate of 30 Gb/s per wavelength are achieved.
ISSN:1943-0655

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