An Alternative Way of Making Bumps for Tape Automated Bonding

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Bibliographic Details
Main Authors: Jindřich Vilím, Karel Kopejtko
Format: Article
Language:English
Published: Wiley 1980-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.6.185
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author Jindřich Vilím
Karel Kopejtko
author_facet Jindřich Vilím
Karel Kopejtko
author_sort Jindřich Vilím
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institution Kabale University
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1563-5031
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publishDate 1980-01-01
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record_format Article
series Active and Passive Electronic Components
spelling doaj-art-77fd093bac884647937f8469bc71b15b2025-02-03T05:48:15ZengWileyActive and Passive Electronic Components0882-75161563-50311980-01-0163-418518710.1155/APEC.6.185An Alternative Way of Making Bumps for Tape Automated BondingJindřich VilímKarel Kopejtkohttp://dx.doi.org/10.1155/APEC.6.185
spellingShingle Jindřich Vilím
Karel Kopejtko
An Alternative Way of Making Bumps for Tape Automated Bonding
Active and Passive Electronic Components
title An Alternative Way of Making Bumps for Tape Automated Bonding
title_full An Alternative Way of Making Bumps for Tape Automated Bonding
title_fullStr An Alternative Way of Making Bumps for Tape Automated Bonding
title_full_unstemmed An Alternative Way of Making Bumps for Tape Automated Bonding
title_short An Alternative Way of Making Bumps for Tape Automated Bonding
title_sort alternative way of making bumps for tape automated bonding
url http://dx.doi.org/10.1155/APEC.6.185
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