An Alternative Way of Making Bumps for Tape Automated Bonding
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Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
Wiley
1980-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/APEC.6.185 |
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_version_ | 1832555426511585280 |
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author | Jindřich Vilím Karel Kopejtko |
author_facet | Jindřich Vilím Karel Kopejtko |
author_sort | Jindřich Vilím |
collection | DOAJ |
format | Article |
id | doaj-art-77fd093bac884647937f8469bc71b15b |
institution | Kabale University |
issn | 0882-7516 1563-5031 |
language | English |
publishDate | 1980-01-01 |
publisher | Wiley |
record_format | Article |
series | Active and Passive Electronic Components |
spelling | doaj-art-77fd093bac884647937f8469bc71b15b2025-02-03T05:48:15ZengWileyActive and Passive Electronic Components0882-75161563-50311980-01-0163-418518710.1155/APEC.6.185An Alternative Way of Making Bumps for Tape Automated BondingJindřich VilímKarel Kopejtkohttp://dx.doi.org/10.1155/APEC.6.185 |
spellingShingle | Jindřich Vilím Karel Kopejtko An Alternative Way of Making Bumps for Tape Automated Bonding Active and Passive Electronic Components |
title | An Alternative Way of Making Bumps for Tape Automated Bonding |
title_full | An Alternative Way of Making Bumps for Tape Automated Bonding |
title_fullStr | An Alternative Way of Making Bumps for Tape Automated Bonding |
title_full_unstemmed | An Alternative Way of Making Bumps for Tape Automated Bonding |
title_short | An Alternative Way of Making Bumps for Tape Automated Bonding |
title_sort | alternative way of making bumps for tape automated bonding |
url | http://dx.doi.org/10.1155/APEC.6.185 |
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