Vilím, J., & Kopejtko, K. An Alternative Way of Making Bumps for Tape Automated Bonding. Wiley.
Chicago Style (17th ed.) CitationVilím, Jindřich, and Karel Kopejtko. An Alternative Way of Making Bumps for Tape Automated Bonding. Wiley.
MLA (9th ed.) CitationVilím, Jindřich, and Karel Kopejtko. An Alternative Way of Making Bumps for Tape Automated Bonding. Wiley.
Warning: These citations may not always be 100% accurate.