Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

Cu thin films were deposited on Si substrates using direct current (DC) magnetron sputtering. Microstructure evolution and mechanical properties of Cu thin films with different annealing temperatures were investigated by atomic force microscopy (AFM), X-ray diffraction (XRD), and nanoindentation. Th...

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Main Authors: Shiwen Du, Yongtang Li
Format: Article
Language:English
Published: Wiley 2015-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2015/969580
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author Shiwen Du
Yongtang Li
author_facet Shiwen Du
Yongtang Li
author_sort Shiwen Du
collection DOAJ
description Cu thin films were deposited on Si substrates using direct current (DC) magnetron sputtering. Microstructure evolution and mechanical properties of Cu thin films with different annealing temperatures were investigated by atomic force microscopy (AFM), X-ray diffraction (XRD), and nanoindentation. The surface morphology, roughness, and grain size of the Cu films were characterized by AFM. The minimization of energy including surface energy, interface energy, and strain energy (elastic strain energy and plastic strain energy) controlled the microstructural evolution. A classical Hall-Petch relationship was exhibited between the yield stress and grain size. The residual stress depended on crystal orientation. The residual stress as-deposited was of tension and decreased with decreasing of (111) orientation. The ratio of texture coefficient of (111)/(220) can be used as a merit for the state of residual stress.
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publishDate 2015-01-01
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series Advances in Materials Science and Engineering
spelling doaj-art-763b854c3d40416597ecd4d3dbdf6bd72025-02-03T01:24:21ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422015-01-01201510.1155/2015/969580969580Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin FilmsShiwen Du0Yongtang Li1School of Materials Science and Engineering, Shanxi Key Laboratory of Metallic Materials Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan 030024, ChinaSchool of Materials Science and Engineering, Shanxi Key Laboratory of Metallic Materials Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan 030024, ChinaCu thin films were deposited on Si substrates using direct current (DC) magnetron sputtering. Microstructure evolution and mechanical properties of Cu thin films with different annealing temperatures were investigated by atomic force microscopy (AFM), X-ray diffraction (XRD), and nanoindentation. The surface morphology, roughness, and grain size of the Cu films were characterized by AFM. The minimization of energy including surface energy, interface energy, and strain energy (elastic strain energy and plastic strain energy) controlled the microstructural evolution. A classical Hall-Petch relationship was exhibited between the yield stress and grain size. The residual stress depended on crystal orientation. The residual stress as-deposited was of tension and decreased with decreasing of (111) orientation. The ratio of texture coefficient of (111)/(220) can be used as a merit for the state of residual stress.http://dx.doi.org/10.1155/2015/969580
spellingShingle Shiwen Du
Yongtang Li
Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
Advances in Materials Science and Engineering
title Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
title_full Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
title_fullStr Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
title_full_unstemmed Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
title_short Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films
title_sort effect of annealing on microstructure and mechanical properties of magnetron sputtered cu thin films
url http://dx.doi.org/10.1155/2015/969580
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